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Huawei unveils chip design breakthrough under US sanctions China’s Huawei has announced a significant advance in chip design as it faces restrictions from US export controls. The company has introduced an approach called τ (Tau) Scaling, aiming to achieve 1.4nm-class density without relying solely on the most advanced lithography equipment. Unable to access TSMC’s foundry services since 2020, Huawei is moving beyond classic Moore’s Law scaling. Its strategy focuses on reducing signal delay within chips, not just shrinking transistor sizes. The new LogicFolding method folds logic components closer together, shortening wires and reducing electrical drag. Huawei claims its next Kirin chip will test this approach, known internally as Her’s Law, and reports 381 chips already produced using these techniques. Plans are in place to reach 1.4nm-class densities by 2031. 📰 @aipost